Industries & Applications

Background Having proper nip roll alignment is crucially important for high-volume printing press machines. Five minutes of run time on misaligned rolls can result in thousands of dollars in damaged product. Depending on the size and location of the nip, taking nip measurements can be difficult...

Background Ultrasonic welding machines are used to create uniform seals, which are vitally important for containing products like contact lenses. In the ultrasonic welding process, thermoplastics are bonded together through the use of heat and applied force. A damaged seal can result in leaky...

Background In high-throughput processing – such as in bottling and food packaging industries – there are several twists, turns and other impacts a product encounters on its way to completion. Quality control personnel take precautions to make sure their systems are running as smoothly as possible...

Achieve Optimal Occlusal Loading with T-Scan™ Research studies show that 54% of patients experience prosthetic complications 1. Although implant dentistry is the best option for most patients improper loading of these implants and crowns can lead to a number of prosthetic and surgical complications...

Wafer Polishing Pressure Measurement Wafer or Chemical Mechanical Polishing (CMP) requires that an even surface is achieved or subsequent manufacturing steps will be adversely affected, costing your company money. The I-Scan™ pressure mapping system provides instantaneous insight into the pressures...

Semiconductor Clamping Pressure Distribution Challenge Unknown clamping forces during computer chip and heat sink mounting or wafer probe testing can cause considerable product defects and quality issues. This can lead to lower yields and increased costs and product waste. Solution The I-Scan™ force...

Evaluate Brush-to-Wafer Contact Pressure Polyvinyl alcohol (PVA) brushes are used in the semiconductor process during the post-CMP cleaning stage. Different PVA brush designs can affect wafer cleaning efficiency. Ensuring proper brush-to-wafer contact pressure and contact area is crucial in...