Pressure mapping reveals where a heat sink makes solid contact — and where gaps exist — so engineers can validate assembly, improve heat dissipation, and reduce thermal failures in high-density electronic systems.

Measure and visualize pressure distribution in wafer clamping and fixturing systems to verify uniform force application, identify misalignment, and reduce the risk of wafer damage during critical process steps.

Evaluate contact and pressure uniformity during wafer polishing processes to improve material removal consistency, optimize pad performance, and support tighter process control.